X-FAB France

98 abonnés
Corbeil-Essonnes (91)
> 100 personnes

Photonics Process Integration and Development Engineer (m/f/x)

  • Contrat
    CDI
  • Niveau requis
    BAC+4
  • Expérience
    Jeune diplômé
  • Localisation
    Corbeil-Essonnes (91) ,France
  • Rémunération
    Selon profil
  • Date de début
    19/07/2022
Publié le 20/07/2022

Description de l'entreprise

Commencez votre avenir maintenant - avec un leader mondial de la haute technologie dans le secteur des semi-conducteurs. S'engager dans des sujets passionnants du futur, s'approprier des tâches et profiter d'excellentes opportunités de carrière. Que ce soit en Allemagne, en France, en Malaisie ou aux États-Unis, impressionnez-nous avec vos connaissances spécialisées. Construisez l'avenir avec nous en tant que membre de l'équipe X-FABulous! Faites ce qui est le mieux pour votre carrière !

Missions

X-FAB is looking for an experienced Photonics Process Integration specialist to join our Process Development team, based in Corbeil-Essonnes, France, but working as part of an international organization. Our Photonics technologies support a distinctive range of modular options using Silicon and Silicon Nitride waveguides. The ideal candidate should have experience of semiconductor processes applied to electronics and photonics Integrated Circuits. Missions * Process Integration and Development of new version of photonics devices and manufacturing flows. * Optimise processes for optical performance, yield and reliability. * Support the transfer of technologies to other X-FAB sites and Heterogenous Integration concepts. * Liaise with customers to support production ramp.

Profil recherché

Requirements * Qualification: Bachelor Degree / Master of Engineering in Material Science, Physics, Microelectronics/Photonics or related subject. PhD desirable * Experience: Minimum 3 year experience in process integration. Skills and competencies * Hands-on experience of process blocks for Photonics and/or optical IC’s. * Understanding of all related unit process steps (lithography, etch, wet cleaning, dielectric deposition, CMP, CVD/PVD, defect management). * Understanding of process and device characterization methods. * A track record of optimizing processes for performance, yield and reliability. * Good understanding of Material Properties and Failure Analysis techniques. * Understanding of design rules and their impact on the devices and characteristics, impact on product performance. * Knowledge of chip and HI/package interactions. * Trained in the formal use of Design-of-Experiments and statistical techniques.

Nous retrouver

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Corbeil-Essonnes, 91, France, Corbeil-Essonnes (91)